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Only One Name Means ProT ek'TionTM
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ST ANDARD CAPACIT ANCE TVS ARRA Y
APPLICA TIONS Cellular Phones MP3 Players Personnal Digital Assistant (PDA) Notebooks Digital Cameras IEC COMPA TIBILITY (EN61000-4) 61000-4-2 (ESD): Air - 15kV, Contact - 8kV 61000-4-4 (EFT): 40A - 5/50ns FEA TURES 100 Watts Peak Pulse Power per Line (tp=8/20s) Available in 2 Voltages: 5V & 12V Up to Four (4) Lines of Protection ESD Protection > 25 kilovolts Low Clamping Voltage MECHANICAL CHARACTERISTICS Molded JEDEC SC-70-4L Package Weight 14 milligrams (Approximate) Flammability rating UL 94V-0 8mm Tape and Reel Per EIA Standard 481 Marking: Marking Code & Pin One Defined By DOT on Package SC-70-5L
PIN CONFIGURA TIONS
1 2 3
5
4
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DEVICE CHARACTERISTICS MAXIMUM RATINGS @ 25C Unless Otherwise Specified
PARAMETER Peak Pulse Power (tp = 8/20s) - See Figure 1 Operating Temperature Storage Temperature Forward Voltage @ 1A, 8/20s SYMBOL PPP TJ TSTG VFP VALUE 100 -55C to 150C -55C to 150C 1.5 UNITS Watts C C Volts
ELECTRICAL CHARACTERISTICS PER LINE @ 25C Unless Otherwise Specified
PART NUMBER DEVICE MARKING CODE RATED STAND-OFF VOLTAGE MINIMUM BREAKDOWN VOLTAGE (See Note 1) @ 1mA V(BR) VOLTS 6.0 13.3 MAXIMUM CLAMPING VOLTAGE (See Fig. 2) @ IP = 1A VC VOLTS 9.5 15.0 MAXIMUM CLAMPING VOLTAGE (See Fig. 2) MAXIMUM LEAKAGE CURRENT MAXIMUM CAPACITANCE
V WM VOLTS PSMF05 PSMF12 05 12 5.0 12.0
@8/20s VC @ IPP 12.0V @ 9.0A 22.0V @ 5.0A
@VWM ID A 10 1
@0V, 1 MHz CJ pF 60 30
Note 1: Test between pins 1 to 2, 3 to 2, 4 to 2 and 5 to 2.
10,000
PPP - Peak Pulse Power - Watts
FIGURE 1 PEAK PULSE POWER VS PULSE TIME
IPP - Peak Pulse Current - % of IPP
120 100 80 60 40 20 0 tf
FIGURE 2 PULSE WAVE FORM
Peak Value IPP TEST WAVEFORM PARAMETERS tf = 8s td = 20s
1,000
e-t
100W 8/20s Waveform 100
td = t I /2 PP
10 0.1
1
10 100 td - Pulse Duration - s
1,000
10,000
0
5
10
15 t - Time - s
20
25
30
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GRAPHS
FIGURE 3 POWER DERATING CURVE
35 Peak Pulse Power 8/20s
5 Volts per Division
100 80
% Of Rated Power
FIGURE 4 OVERSHOOT & CLAMPING VOLTAGE FOR PSMF05
25
60
15
40 20 Average Power 0 0 25 50 75 100 125 TL - Lead Temperature - C 150
5
-5
ESD Test Pulse: 5 kilovolt, 1/30ns (waveform)
16
VC - Clamping Voltage - Volts
FIGURE 5 TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR PSMF05
12
8
4
0 0 2 4 6 IPP - Peak Pulse Current - Amps 8 10
160
FIGURE 6 TYPICAL REVERSE VOLTAGE VS CAPACITANCE FOR PSMF05
120
C - Capacitance - pF
80
40
0 0 1 2 3 4 VR - Reverse Voltage - Volts 5 6
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APPLICA TION NOTE
The PSMF Series are TVS arrays designed to protect I/O or data lines from the damaging effects of ESD or EFT. This product provides unidirectional protection, with a surge capability of 200 Watts PPP per line for an 8/20s waveform and ESD protection > 25 kilovolts. UNIDIRECTIONAL COMMON-MODE CONFIGURATION (Figure 1) The PSMF Series provides up to four (4) lines of protection in a common-mode configuration as depicted in Figure 1. Circuit connectivity is as follows:

I/O 1 is connected to Pin 1. I/O 2 is connected to Pin 3. I/O 3 is connected to Pin 4. I/O 4 is connected to Pin 5. Pin 2 is connected to ground.
Figure 1 - Unidirectional Configuration Common-Mode I/O Port Protection
I/O 4 I/O 3
CIRCUIT BOARD LAYOUT RECOMMENDATIONS Circuit board layout is critical for Electromagnetic Compatibility (EMC) protection. The following guidelines are recommended:
I/O INTEGRATED CIRCUIT
5
4
The protection device should be placed near the input terminals or connectors, the device will divert the transient current immediately before it can be coupled into the nearby traces. The path length between the TVS device and the protected line should be minimized. All conductive loops including power and ground loops should be minimized. The transient current return path to ground should be kept as short as possible to reduce parasitic inductance. Ground planes should be used whenever possible. For multilayer PCBs, use ground vias.
1
I/O 2 I/O 1
2
3

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PACKAGE OUTLINE & DIMENSIONS
PACKAGE OUTLINE
SC70-6L
D E
6
5
4 K J 0 - 8
PACKAGE DIMENSIONS
DIM MILLIMETERS MIN MAX 1.90 1.15 0.80 0.15 0.65 BSC 1.30 BSC 0.80 0.08 2.00 0 0.26 2.15 1.35 1.00 0.30 1.10 0.25 2.20 0.10 0.46 INCHES MIN MAX 0.074 0.045 0.031 0.006 0.0255 BSC 0.0512 BSC 0.031 0.003 0.078 0 0.010 0.084 0.055 0.040 0.012 0.043 0.010 0.086 0.004 0.018
1
2
3 L B M J
F A
G
C
A B C D E F G J K L M
NOTES
MOUNTING PAD
TYPICAL DIM Millimeters 1 2 3 4 5 6 7 0.50 1.30 0.65 1.72 0.60 1.11 2.33 Inches 0.020 0.051 0.026 0.068 0.024 0.044 0.092 4
1. Dimensioning and tolerances per ANSI Y14.5M, 1985. 2. Controlling Dimension: Inches 3. Dimensions are exclusive of mold flash and metal burrs. 3 TAPE & REEL ORDERING NOMENCLATURE 2 1. Surface mount product is taped and reeled in accordance with EIA-481. 2. Suffix-T7 = 7 Inch Reel - 3,000 pieces per 8mm tape, i.e., PSMF05-T7. 3. Suffix-LF = Lead-Free, Pure Tin Plating, i.e., PSMF05-LF-T7.
1 5 6 7
Outline & Dimensions: Rev 2 - 2/04, 06005
COPYRIGHT (c) ProTek Devices 2004 SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC). DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer's and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products.
ProTek Devices 2929 South Fair Lane, Tempe, AZ 85282 Tel: 602-431-8101 Fax: 602-431-2288 E-Mail: sales@protekdevices.com Web Site: www.protekdevices.com
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